Direct Optical Wire (DOW)
Today’s data centers is struggling to cope with increasing demands for real-time video streams, machine learning (ML) resources, artificial intelligence (AI), 5G/6G applications, defense and security.
The disruptive innovation of direct optical wiring (DOW) in integrated optical interconnects will fertilize the future.
Direct Optical Wire (DOW) Bonding Technology
- Cutting-edge metal wire bonding-like optical wire
- Simple open-to-air polymerization of a polymer solution
- Nanoscale ultra-thin diameter, as thin as 0.2 μm
- Robust and reliable thermo-mechanical properties
-High-temperature/high-humidity resistance up to 250°C
-Low-temperature resistance of – 70°C
Datacenter Optical Interconnects
Key Features of Direct Optical Wired (DOW) Optical Interconnects
Highly-Integrated Low Power Consumption Optical Engines
400G QSFP112 SR4 Optical Transceiver
800G QSFP112-DD SR8 Optical Transceiver
Customized Design Optical Packaging
DOW-based Silicon Photonics Optical Coupling
DOW-based Silicon Photonics Optical Coupling
Single-Cell Analysis
Single-Cell In-situ Analysis
