Technology

Direct Optical Wiring (DOW)

Disruptive innovation in optical interconnects

Today’s data centers are struggling to cope with increasing demands for artificial intelligence (AI), machine learning (ML) workloads or 5G/6G applications, defense and security.

The disruptive innovation of direct optical wiring (DOW) in integrated optical interconnects will drive the future of high-performance computing.
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Direct Optical Wiring (DOW) Bonding Technology

  • Cutting-edge metal wire bonding-like optical wiring
  • Simple open-to-air polymerization of polymer solution
  • Nanoscale ultra-thin diameter, as thin as 0.2 μm
  • Robust and reliable thermo-mechanical properties
    -High-temperature/high-humidity resistance up to 250°C
    -Low-temperature resistance of – 70°C
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Datacenter Optical Interconnects

Key Features of DOW Optical Interconnects

No active
alignment
Cost-competitive
optical coupling
Free from lens
assembly
Nearly zero optical
crosstalk
No
air gap
Very low reflection noise
compared to the others
High freedom of heat
sink design
Advantages in
thermal management
LESSENGERS-
patented technology
37 patents granted/
pending worldwide

Highly-Integrated Low Power Consumption Optical Engines

400G QSFP112 SR4
Optical Transceiver

800G QSFP112-DD SR8
Optical Transceiver

Customized Design Optical Packaging

Key Features of DOW Optical Interconnects

Ultra-small form factor optical interconnects
Less than a millimeter dimension
Cost-competitive optical
coupling
Free from lens assembly / mold tooling
No optical crosstalk / no air
gap-induced noise
Excellent optical signal integrity

DOW-based Silicon Photonics Optical Coupling

DOW-based Silicon Photonics Optical Coupling

Single-Cell Analysis

Key Features of Direct Optical Wiring (DOW) Optical Interconnects

Nanometer scale DOW- prepared optical wiring,
enabling single cell in-situ analysis
Quantitative single-cell optical technologies,
e.g., fluorescence microscopy

Single-Cell In-situ Analysis

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